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???? ?? : 4 2878 ?h l 25 ? 5f 5f , no. 25, key a r d . daya t o wnship, t a ichung county , t a iwan web : http: //www .r aystar - o ptr onics. c om e- m a il: sal e s@ra ystar - optronics.co m t e l:886- 4- 2565- 0 7 61 fax 886- 4- 2 565- 07 60 rc1602b-biw -esx specifica tion cust omer: approved by pcb version da te for cus t o mer use onl y sales by approved by che cke d by pr ep ar ed by issued da te: page 1 , t o t a l 28 pa ges
rc1602b-biw -esx contents 1. revision history page 3 2 . g e n e r a l s p e c i f i c a t i o n 4 3. module coding system 5 4. interface pin function 6 5. outline dimension & block diagram 7 6 . d i s p l a y control i n s t r u c t i o n 8 7. character generator rom patter n 1 1 8 . i n s t r u c t i o n t a b l e 1 2 9 . t i ming c h a r a c t e r i s t i c s 1 3 10. initializing of lc m 15 1 1 . o p t i c a l c h a r a c t e r i s t i c s 1 7 12. absolute maximum ratings 18 1 3 . e l e c t r i c a l c h a r a c t e r i s t i c s 1 8 1 4 . b a c k l i g h t i n f o r m a t i o n 1 9 1 5 . r e l i a b i l i t y 2 0 1 6 . i n s p e c t i o n s p e c i f i c a t i o n 2 1 17. precautions in use of lcd modules 25 18. material list of components for rohs 26 page 2 , t o t a l 28 pa ges
page 3 , total 28 pages 1. revision history date version revised page no. note 2008.06.17 1 first issue
page 4 , total 28 pages 2. general specification the features is described as follow: ? module dimension: 80. 0 x 36.0 x 13.2 (max.) mm 3 ? view area: 66.0 x 16.0 mm 2 ? active area: 56.20 x 11.5 mm 2 ? number of characters: 16 characters x 2 lines ? dot size: 0.55 x 0.65 mm 2 ? dot pitch: 0.60 x 0.70 mm 2 ? character size: 2.95 x 5.55 mm 2 ? character pitch: 3.55 x 5.95 mm 2 ? lcd type: stn negative, blue transmissive, ? duty: 1/16 ? view direction: 6 o?clock ? backlight type: led white
page 5 , total 28 pages 3. module coding system r c 1602 b - b i w - esx 1 2 3 4 - 5 6 7 - 8 item description 1 r raystar optronics inc. c character type 2 display g graphic type 3 number of dots character 16 words, 2 lines. 4 serials code p tn positive, gray n tn negative, g stn positive, gray y stn positive, yellow green b stn negative, blue f fstn positive 5 lcd t fstn negative a reflective, n.t, 6:00 k transflective, w.t,12:00 d reflective, n.t, 12:00 1 transflective, u.t,6:00 g reflective, w. t, 6:00 4 transflective, u.t.12:00 j reflective, w. t, 12:00 c transmissive, n.t,6:00 0 reflective, u. t, 6:00 f transmissive, n.t,12:00 3 reflective, u. t, 12:00 i transmissive, w. t, 6:00 b transflective, n.t,6:00 l transmissive, w.t,12:00 e transflective, n.t.12:00 2 transmissive, u. t, 6:00 6 polarizer type, temperature range, view direction h transflective, w.t,6:00 5 transmissive, u.t,12:00 n without backlight y led, yellow green p el, blue green a led, amber t el, green w led, white d el, white o led, orange 7 backlight f ccfl, white g led, green 8 special code es: english and european standard font. x: without negative voltage.
page 6 , total 28 pages 4. interface pin function pin # symbol level description 1 v ss 0v ground 2 v dd 5.0v supply voltage for logic 3 vo (variable) operating voltage for lcd 4 rs h/l h: data, l: instruction code 5 r/w h/l h: read(mpu module) l: write(mpu module) 6 e h,hl chip enable signal 7 db0 h/l data bus line 8 db1 h/l data bus line 9 db2 h/l data bus line 10 db3 h/l data bus line 11 db4 h/l data bus line 12 db5 h/l data bus line 13 db6 h/l data bus line 14 db7 h/l data bus line 15 a led + 16 k led
5. outline dimension &block diagram 31 .0 71.2 56 .2 ( a a ) 66 .0 ( v a ) 80 .0 0.5 1 4.95 16 k a 2.5 4- 2 . 5 pth 4- 5 . 0 pa d do t s i z e scal e 5 / 1 12.45 7.55 12. 55 10. 3 1 6 . 0 (va) 1 1 . 5 (aa) 5.7 25.2 36.0 0.5 5. 08 2.5 75.0 db 5 12 15 16 14 13 a k db 7 db 6 vs s 1 db 0 7 11 10 8 9 db 4 db 3 db 2 db 1 4 6 5 3 2 rs e r/ w vo vdd 15 .7 6 8.0 p 2 .54*15=38.1 1.8 16- o 1. 0 p t h 4- o 1.0 3.0 40.55 18.3 2 1.6 0.5 5 0.6 2. 95 0.6 0. 65 0.7 5.5 5 5.95 0. 4 3.55 t h e no n - sp e c if ie d to le r a n c e of d i m e n s i o n i s 0 . 3m m . 8.6 13 . 2 m a x led b / l external contra s t a d j u s t m e n t . 10k~ 2 0 k vr vs s vo vdd option a l n.v. generato r p o w er c i rcuit bias a n d vdd, vs s, v1 ~v 5 s e g4 1~ 8 0 eq uiv a lent or cl2 cl1 m seg dri v er d seg1~40 co m 1 ~ 1 6 16x2 lcd hd 44 78 0 co ntro ller/com driv er 68 ser i e s or db 0~ db7 e r/w rs 80 series mpu dd ra m ad dre s s dd ra m ad dre s s cha r a c t e r lo cat ed 15 16 13 11 12 14 10 9 8 7 6 5 4 2 13 4f 0f 4e 0e 4d 0d 4c 0c 4b 0b 4a 0a 49 09 48 08 47 07 46 06 45 05 44 04 43 03 42 02 41 01 40 00 page 7 , t o t a l 28 pa ges
6. display control instruction the lcd display module is built in a lsi contro ller , the controller has two 8- bit registers, an instruction register (ir ) and a dat a register (dr). the ir stores instruction codes, such as display clear and cursor shif t, and address information for display dat a ram (ddram) and c haracter generator (cgra m). the ir can only be written from the mpu. the dr temporarily stores dat a to be written or read from ddram or cgram. when address information is writ ten into the ir, then dat a is stored into the dr from ddram or cgram. by the register selector (r s) signal, these two registers can be selected. r s r / w o p e r a t i o n 0 0 ir write as an internal oper ation (display clear , etc.) 0 1 read busy flag (db7) and addres s counter (db0 to db7) 1 0 w r ite dat a to ddram or cgram (dr to ddram or cgram) 1 1 read dat a from ddram or cg r a m (ddram or cgr a m to dr) busy flag (bf) when the busy flag is 1, the controller lsi is in the internal oper ation mode, and the next instruction will not be accepted. when rs=0 and r/w=1, the busy flag is output to d b 7. the next instruction must be written af ter ensuring that the busy flag is 0. address counter (ac) the addres s counter (ac) assigns addr esses to both d dram and cgram. displa y da t a ram (ddram) this ddram is used to store the display dat a represented in 8-bit character codes. it s extended cap a city is 808 bit s or 80 characte rs. below figure is the relationship s between ddram addresses and positions on the liquid cryst al display . ac (hexadecimal) low bits high bits exa m ple: ddram addresses 4e ac6 ac5 ac4 ac3 ac2 ac1 ac0 1 0 0 1 1 1 0 page 8 , t o t a l 28 pa ges
1 2 3 4 5 6 7 8 9 10 1 1 12 13 14 15 16 0 0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 08 09 0a 0b 0c 0d 0 e 0 f 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 48 49 4a 4b 4c 4d 4 e 4 f 2 - l i n e b y 1 6 - c h a r a c t e r d i s p l a y display position ddram address character generator rom (cgrom) the cgrom generate 58 dot or 510 dot character p a tterns from 8-bit character codes. see t a ble 2. charact er generator ram (cgram) in cgram, the user can rewrite characte r by program. for 58 dot s, eight character p a tterns can be written, and for 510 dot s, four character p a tterns can be written. w r ite into ddram the character code at the addresses shown as the lef t col u mn of t able 1. t o show the character p a tterns stored in cgram. page 9 , t o t a l 28 pa ges
relationship between cgram addr esses, char acter codes (ddram) and character patterns t a ble 1. f o r 5 * 8 d o t c h a r a c te r p a tte r n s ch a r a c t e r co d e s ( ddr am d a t a ) cg r a m a d d r e s s c h ar act er p a t t e r n s ( cg ra m d a t a ) 54 3 2 1 0 6 75 4 3 2 0 17 6 5 4 3 2 1 0 00 0 0 01 1 00 1 01 0 10 0 11 1 10 1 11 0 00 0 01 1 00 1 01 0 10 0 11 1 10 1 11 0 00 0 01 0 10 0 11 1 10 1 11 ** * ** * ** * ** * ** * ** * ** * * * * 0 0000 ** * ** * ** * ** * ** * ** * ** * * * * 0 0000 00 0 0 00 0 0 00 0 0 00 0 000 000 00 0 00 0 0 000 000 0 000 0 01 ** * ** * 11 1 000 0 * 1 1 1 00 00 * 0 00 000 0 * 00 1 h i g h l o w h i g h l o w h i g h l o w f o r 5 * 10 dot c h a r a c t e r p a t t e r n s ch a r a c t e r co d e s ( ddr am d a t a ) cg r a m a d d r e s s c h ar act er p a t t e r n s ( cg ra m d a t a ) 7 h i g h l o w 4 5 63 2 1 0 h i g h l o w 54 3 2 1 0 h i g h l o w 76 5 4 1 2 30 ** * 0 0000 0 0000 ** * ** * ** * ** * ** * ** * ** * ** * ** * ** * ** ** **** 00 00 00 0 1 00 1 0 00 11 01 0 0 01 0 1 01 1 0 0 111 10 0 0 10 0 1 10 10 1 111 0 0000 000 0 * 00 0 0 0 00 00 000 000 0 0000 0000 0000 c h ar act e r p a t t e rn ( 1 ) c u r s or pa t t e r n c h ar act e r p a t t e rn ( 2 ) c u r s or pa t t e r n c h ar act e r p a tte r n c u r s or pa t t e r n : " h i g h " pag e 10 , to tal 28 pag e s
7. character generator rom pattern t a ble 2. llll lllh l l hl l l h h lhll l h l h l h h l lh hh hlll h llh h l hl h l h h h h ll h h l h h h h l up p e r 4 bi t lowe r 4 bi t ll ll ll lh ll h l ll h h lh l l lh l h lh hl lh hh hl l l hl l h hl h l hl h h hhl l hhl h hhh l hhh h hhhh cg ra m ( 1 ) cg ra m ( 2 ) cg ra m ( 3 ) cg ra m ( 4 ) cg ra m ( 5 ) cg ra m ( 6 ) cg ra m ( 7 ) cg ra m ( 8 ) cg ra m ( 1 ) cg ra m ( 2 ) cg ra m ( 3 ) cg ra m ( 4 ) cg ra m ( 5 ) cg ra m ( 6 ) cg ra m ( 7 ) cg ra m ( 8 ) pag e 11 , to tal 28 pag e s
page 12 , total 28 pages 8. instruction table instruction code instruction rs r/w db7 db6 db5 db4 db3 db2 db1 db0 description execution time (fosc=270khz) clear display 0 0 0 0 0 0 0 0 0 1 write ?00h? to ddram and set ddram address to ?00h? from ac 1.53ms return home 0 0 0 0 0 0 0 0 1 set ddram address to ?00h? from ac and return cursor to its original position if shifted. the contents of ddram are not changed. 1.53ms entry mode set 0 0 0 0 0 0 0 1 i/d sh assign cursor moving direction and enable the shift of entire display. 39s display on/off control 0 0 0 0 0 0 1 d c b set display (d), cursor (c), and blinking of cursor (b) on/off control bit. 39s cursor or display shift 0 0 0 0 0 1 s/c r/l set cursor moving and display shift control bit, and the direction, without changing of ddram data. 39s function set 0 0 0 0 1 dl n f set interface data length (dl:8-bit/4-bit), numbers of display line (n:2-line/1-line)and, display font type (f:511 dots/58 dots) 39s set cgram address 0 0 0 1 ac5 ac4 ac3 ac2 ac1 ac0 set cgram address in address counter. 39s set ddram address 0 0 1 ac6 ac5 ac4 ac3 ac2 ac1 ac0 set ddram address in address counter. 39s read busy flag and address 0 1 bf ac6 ac5 ac4 ac3 ac2 ac1 ac0 whether during internal operation or not can be known by reading bf. the contents of address counter can also be read. 0s write data to ram 1 0 d7 d6 d5 d4 d3 d2 d1 d0 write data into internal ram (ddram/cgram). 43s read data from ram 1 1 d7 d6 d5 d4 d3 d2 d1 d0 read data from internal ram (ddram/cgram). 43s
9. timing characteristics 9 . 1 w r ite operation t a =25 , vdd=5.0v i t e m s y m b o l m i n t y p m a x u n i t enable cycle time t c 1200 ns enable pulse wid th t pw 140 ns enable rise/fall time t r ,t f 2 5 n s address set-up time (rs, r/w to e) t as 0 ns address hold time t ah 10 ns dat a set-up time t dsw 40 ns dat a hold time t h 10 ns pag e 13 , to tal 28 pag e s
9.2 read operation t a =25 , vdd=5v i t e m s y m b o l m i n t y p m a x u n i t enable cycle time t c 1200 ns enable pulse wid th (high level) t pw 140 ns enable rise/fall time t r ,t f 2 5 n s address set-up time (rs, r/w to e) t as 0 ns address hold time t ah 10 ns dat a delay time t ddr 1 0 0 n s dat a hold time t h 10 ns pag e 14 , to tal 28 pag e s
10. initializing of lc m 0 r/ w 0 0 r/ w 0 0 r/ w 0 0 0 0 0 r/ w 0 r/ w w a i t fo r m o re t h an 4 0 m s a f ter v dd r i ses t o 4 . 5 v r/ w 0 rs rs 0 0 0 rs 0 0 0 rs 0 0 0 rs rs 0 di s p l a y cl e a r e n t r y m o de s e t di s p l a y o n / o f f c o n t r o l 4-b i t i n eterf a c e in itia liz a t i o n e n d s 01 s h i/ d ** ** w a i t f o r m o re t h a n 3 7 s db 3 w a i t f o r m o re t h an 1 .5 3 ms db 3 db 3 db 4 db6 db 7 d b 5 db5 db 7 0 db6 0 0 0 0 0 db 4 0 0* 0 1 0 0 * * db5 db 7 0 1 0 d db6 b 0 db 4 0 c * * db 2 d b 1 d b 0 * db 0 * * db 1 db 2 ** * * * * * * db 0 db 1 * * db 2 * * b f can not be checked be f o r e t h i s i n st r u ct i on. b f can not be checke d bef o r e t h i s i n st ruct i on. funct i on s e t f u n c tio n s e t b f can not be checke d bef o r e t h i s i n st ruct i on. w a i t f o r m o r e t h an 37us db 3 w a i t f o r m o re t h a n 3 9 s db 3 w a i t f o r m o r e t h an 39us db5 f n db 7 0 db6 0 * ** 0 db 4 1 * db5 00 nf db 7 d b 6 * 10 * ** db 4 * * db 0 * * db 1 db 2 ** fu nct i on s e t * db 0 * * * ** db 1 db 2 db 3 db5 db 7 00 db6 1 db 4 1 * pow e r on * db 0 db 1 * db 2 * pag e 15 , to tal 28 pag e s
po w e r o n rs r/ w db 7 d b 6 db 5 d b 4 db 3 d b 2 db 1 d b 0 w a i t fo r m o re t h a n 4 0 m s a f t e r v dd r i se s t o 4 . 5 v w a i t fo r m o re t h a n 3 9 u s 1 db 4 db 6 0 db 5 1 db 1 db 2 db 3 f** db 0 db 4 db 7 rs r/ w db 6 d b 5 db 1 db 2 db 3 d b 0 000000 1 b c d i n itia l iz a t io n e n d s b f c a n n o t b e c h e c ke d be f o r e t h i s i n s t r u c t i o n . f u nc t i on s e t f u nc t i on s e t b f c a n n o t b e c h e c ke d be f o r e t h i s i n s t r u c t i o n . 8 - b i t i n et er f ace w a i t fo r m o re t h a n 3 7 u s di s p l a y on/ of f c o n t r o l 0 00 0 1 1* f* 0 00 r/ w 0 r/ w 0 0 rs rs 0 e n tr y m o d e s e t db 3 w a i t fo r m o re t h a n 1 .5 3 ms 0 00 0 0 db 5 db 7 d b 6 db 4 i/ d 1s db 0 db 1 db 2 di s p l a y c l e a r db 3 w a i t fo r m o re t h a n 3 7 s db 5 db 7 00 db 6 d b 4 0 00 db 0 1 db 1 0 db 2 0 rs r/ w db 7 n n pag e 16 , to tal 28 pag e s
11. optical characteristics i t e m s y m b o l condition m i n t y p m a x u n i t (v) c r 2 R 2 0 4 0 d e g v i ew a n gl e (h) c r 2 R - 3 0 3 0 d e g contrast ratio cr 3 t rise 1 5 0 2 0 0 m s response t i me t fall 1 5 0 2 0 0 m s definition of operation v o lt age (v op) def i nition of res ponse t i me ( t r , tf ) d r iv i n g v o lt a g e ( v ) in te n s ity cr m a x 100 8 vo p s e l ect ed w a v e no n - s e l e c t e d w a v e [ p o s itiv e ty p e ] c r = l on / l o f f in te n s i t y 90 8 10 0 8 tr 10 8 tf n o n- sel ect ed c oni t i on n on- s e l e ct e d co n i t i o n s e l ect ed c o n i t i o n [ p o s i tiv e t y p e ] conditions : operating v o lt age : v op v i ewing angle( ) : 0 ? 0 frame frequency : 64 hz driving w a veform : 1/n duty , 1/a bias definition of vi ewing angle(cr R 2) e f y = 18 0 c y = 90 c y = 0 c y = 27 0 c e b e r e l pag e 17 , to tal 28 pag e s
page 18 , total 28 pages 12. absolute maximum ratings item symbol min typ max unit operating temperature t op -20 +70 storage temperature t st -30 +80 input voltage v i v ss v dd v supply voltage for logic v dd -v ss -0.3 7 v supply voltage for lcd v dd -v 0 -0.3 13 v 13. electrical characteristics item symbol condition min typ max unit supply voltage for logic v dd -v ss 4.5 5.0 5.5 v supply voltage for lcd v dd -v 0 ta = - 2 0 ta = 2 5 ta = 7 0 3.2 3.7 5.2 v v v input high volt. v ih 0.7 v dd v dd v input low volt. v il v ss 0.6 v output high volt. v oh 3.9 v output low volt. v ol 0.4 v supply current i dd v dd =5.0v 1.0 1.2 1.5 ma
14. backlight information s p ecification p a ramet e r s y m b o l m i n t y p m a x u n i t test condition suppl y c u r r e n t i l e d 2 8 . 8 3 2 4 0 m a v = 3 . 5 v suppl y v o l t a g e v 3 . 3 3 . 5 3 . 7 v reverse v o lt age vr 5 v luminous intensity iv 24 5. 6 30 7 cd/m 2 iled=32ma chromaticity x 0.300 y 0.310 life t i me (for reference onl y ) 30k hr . iled Q 32ma 25 ,50 -60% rh, (note 1) c o l o r w h i t e note: the led of b/l is drive by current onl y , drive volt age is for re ference onl y . dr ive volt age can make driving c u rrent under safet y area (current betw ee n minimum an d maximum). (wil l never get ve e output from pi n15) pin16 pin15 lcm r 2.drive from pi n15,pin16 r a k b/l pag e 19 , to tal 28 pag e s
15. reliability content of reliability t est ( w ide temperatu r e, -20 ~7 0 ) environment a l t est t est item content of t est condition note high t e mper at ure storag e endur ance test appl yin g the high st orag e temperatur e for a lon g time. 80 200 hrs 2 lo w t e mper atu r e storage endur ance test appl yin g the high st orag e temperatur e for a lon g time. -30 200 hrs 1,2 high t e mper at ure operati o n endur ance tes t appl yi ng th e electric stress (v olt age & c u r r ent) and the th erma l stress to the element for a lo ng time. 70 200 hrs - lo w t e mper atu r e operatio n endur ance t e st appl yi ng the el ectric stress und er lo w temperatur e for a long time. -20 200 hrs 1 high t e mper at ure/ humid i t y oper ation t he module sh ould be al lo w e d to st and at 6 0 ,90% rh max f o r 96hrs un de r no-loa d con d i t ion e x cl udi ng the po lariz e r , t hen t a king it out and dr yi ng it at normal tem peratur e. 60 ,90%rh 96hrs 1,2 t hermal shock resist ance t he sample sh ould be al lo w e d st and the foll o w in g 10 c y cl e s of oper ation - 2 0 2 5 7 0 30min 5min 30min 1 c y c l e -20 /70 10 c y c l es - v i brati on test endur ance tes t appl yi ng th e vibratio n d u rin g transp o rt atio n an d using. fix e d amplitu de: 15mm v i brati on. f r eque nc y : 10~ 55hz. one c y cl e 60 seconds to 3 directio ns of x , y , z f o r each 15 minutes 3 s t atic electricit y test endur ance test appl yi ng the el ectric stress to the termina l. vs= 800v ,rs= 1.5k ? cs= 100 pf 1 time ?? note1 : no d e w cond ens a tion to be o b serv e d. note2 : the function tes t shall be con ducted af ter 4 hours s t or age at the n o rmal tempe r atur e and h u midit y af te r remov e from the tes t chambe r . note3: v i bration test w ill be conducted to the product it self w i t hout putting it in a cont ainer . pag e 20 , to tal 28 pag e s
16. inspection specification pag e 21 , to tal 28 pag e s n o i t e m c r i t e r i o n aql 01 electrical t e sting 1.1 missing vertical, horizont al segment, segment contrast defect. 1.2 missing character , dot or icon. 1.3 display malfunction. 1.4 no function or no display . 1.5 current consumption exce eds product specifications. 1.6 lcd viewing angle def ect. 1.7 mixed product types. 1.8 contrast defect. 0.65 02 black or white spot s on lcd (display only) 2.1 white and black spot s on display Q 0.25mm, no more than three white or black spot s present. 2.2 densely sp aced: no more than two spot s or lines within 3mm 2.5 3.1 round type : as following drawing =( x + y ) / 2 2.5 03 lcd black spot s, white spot s, cont aminatio n (non-display) 3.2 line type : (as following drawing) length w id t h a c c e p t a b l e q ty --- w Q 0.02 accept no dense l Q 3.0 0 .02 w Q 0.03 l Q 2.5 0 .03 w Q 0.05 2 --- 0.05 w as round type 2.5 04 polarizer bubbles if bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. size a c c e p t a b l e q ty Q 0.20 accept no dense 0.20 Q 0.50 3 0.50 Q 1.00 2 1.00 0 to t a l q t y 3 2.5
n o i t e m c r i t e r i o n aql 05 scratches follow no.3 lcd blac k s pot s, white spot s, cont amination 06 chipp ed glass symbols define: x: chip len g th y: chip wid t h z: chip thickne ss k: seal wid t h t: glass thickness a: lcd side length l: electrode p ad lengt h: 6.1 general glass chip : 6.1.1 chip on p anel s u rface and crack between p anels : z: chip thickness y: chip wid th x: chip len g th z Q 1/2t not over viewing area x Q 1/8a 1/2t z Q 2t not exceed 1/3k x Q 1/8a if there are 2 or more chip s, x is tot a l length of each chip. 6.1.2 corner crack: z: chip thickness y: chip wid th x: chip len g th z Q 1/2t not over viewing area x Q 1/8a 1/2t z Q 2t not exceed 1/3k x Q 1/8a if there are 2 or more chip s, x is the tot a l l ength of each chip. 2.5 pag e 22 , to tal 28 pag e s
n o i t e m c r i t e r i o n aql 06 glass crack symbols : x: chip len g th y: chip wid t h z: chip thickne ss k: seal wid t h t: glass thickness a: lcd side length l: electrode p ad lengt h 6.2 protrusion over terminal : 6.2.1 chip on electrode p ad : y: chip wid th x: chip len g th z: chip thickness y Q 0 . 5 m m x Q 1 / 8 a 0 z Q t 6.2.2 non-conductive portion: y: chip wid th x: chip len g th z: chip thickness y Q l x Q 1 / 8 a 0 z Q t if the chipped area touches the it o terminal, over 2/3 of the it o must remain and be inspected according to electrode terminal specifications . if the product will be heat s ealed by the customer , the alignment mark not be damaged . 6.2.3 substrate protuberanc e and internal crack. y: wid th x: length y Q 1 / 3 l x Q a 2.5 pag e 23 , to tal 28 pag e s
n o i t e m c r i t e r i o n aql 07 cracked glass the lcd with extensiv e crack is not accept able. 2.5 08 backlight element s 8.1 illumination source flickers when lit. 8.2 s pot s or scratched that appear when lit must be judged. using lcd spot, lines and cont amination st andards. 8.3 backlight doesn?t li ght or color wrong. 0.65 2.5 0.65 0 9 b e z e l 9.1 bezel may not have rust, be deformed or have fingerprint s , st ains or other cont amination. 9.2 bezel must compl y with job specifications. 2.5 0.65 10 pcb cob 10.1 cob seal may not have pinholes larger than 0.2mm or cont amination. 10.2 cob seal surface may not have pinholes through to the ic. 10.3 the height of the cob should not exceed the height indicated in the assembly diagram. 10.4 there may not be more than 2mm of sealant out side the seal area on the pcb. and there should be no more than three places. 10.5 no oxidation or cont amination pcb terminals. 10.6 part s on pcb must be the same as on the production characteristic chart. there should be no wrong p a rt s, missing p a r t s or excess p a rt s. 10.7 the jumper on the pcb sh ould conform to the product characteristic chart. 10.8 if solder get s on bezel t ab p ads, led p a d, zebra p ad or screw hold p ad, make sure it is smoothed down. 10.9 the scraping testing st andard for copper coating of pcb y x x * y<=2mm 2 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5 1 1 s o l d e r i n g 1 1 .1 no un-melted solder p a ste may be present on the pcb. 1 1 .2 no cold solder joint s , missing solder connections, oxidation or icicle. 1 1 .3 no residue or solder balls on pcb. 1 1 .4 no short circuit s i n component s on pcb. 2.5 2.5 2.5 0.65 pag e 24 , to tal 28 pag e s
page 25 , total 28 pages no item criterion aql 12 general appearance 12.1 no oxidation, contami nation, curves or, bends on interface pin (olb) of tcp. 12.2 no cracks on interface pin (olb) of tcp. 12.3 no contamination, solder residue or solder balls on product. 12.4 the ic on the tcp may not be damaged, circuits. 12.5 the uppermost edge of t he protective strip on the interface pin must be present or look as if it causes the interface pin to sever. 12.6 the residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 sealant on top of the ito circuit has not hardened. 12.8 pin type must match type in specification sheet. 12.9 lcd pin loose or missing pins. 12.10 product packaging must the same as specified on packaging specification sheet. 12.11 product dimension and st ructure must conform to product specification sheet. 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65 17. precautions in use of lcd modules 1. avoid applying excessive shoc ks to the module or making any alterations or modifications to it. 2. don?t make extra holes on the printed ci rcuit board, modify its shape or change the components of lcd module. 3. don?t disassemble the lcm. 4. don?t operate it above t he absolute maximum rating. 5. don?t drop, bend or twist lcm. 6. soldering: only to the i/o terminals. 7. storage: please storage in anti-static el ectricity container and clean environment.
page 26 , total 28 pages 18. material list of components for rohs 1. raystar optronics co., ltd. hereby declares that all of or part of products, including, but not limited to, the lcm, acce ssories or packages, manufactu red and/or delivered to your company (including your subsidiaries and affilia ted company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable eu directives and regulations, including the following substances. exhibit a the harmful material list material (cd) (pb) (hg) (cr6+) pbbs pbdes limited value 100 ppm 1000 ppm 1000 ppm 1000 ppm 1000 ppm 1000 ppm above limited value is set up according to rohs. 2. process for rohs requirement (1) use the sn/ag/cu soldering surface the surface of pb-free sol der is rougher than we used before. (2) heat-resistance temp. reflow 250 , 30 seconds max. connector soldering wave or hand soldering 320 , 10 seconds max. (3) temp. curve of reflow, max. temp. 2355 recommended customer?s soldering temp. of connector 280 , 3 seconds.
page: 1 lcm sample estimate feedback sheet module number 1 panel s p ecification 1. panel t y pe pass n g , 2. v i ew direction pass n g , 3. numbers of dot s pass n g , 4. v i ew area pass n g , 5. active area pass n g , 6.operating t e mperature pass n g , 7.s t orage t e mperature pass n g , 8.others 2 mechanical s p ecification 1. pcb size pass n g , 2.frame size pass n g , 3.materal of frame pass n g , 4.connector position pass n g , 5.fix hole position pass n g , 6.backlight position pass n g , 7. thickness of pcb pass n g , 8. height of frame to pcb pass n g , 9.height of module pass n g , 10.others pass n g , 3 relativ e hole size 1.pitch of connector pass n g , 2.hole size of connector pass n g , 3.mounting hole siz e pass n g , 4.mounting hole t y pe pass n g , 5.others pass n g , 4 backlig ht s p ecification 1.b/l t y pe pass n g , 2.b/l color pass n g , 3.b/l driving v o lt age (reference for led t y pe) pass n g , 4.b/l driving current pass n g , 5.brightness of b/l pass n g , 6.b/l solder method pass n g , 7.others pass n g , go to p a ge 2 pag e 27 , to tal 28 pag e s
pag e 28 , to tal 28 pag e s p a g e : 2 module number 5 electronic characte ristics of module 1.input v o lt age pass n g , 2.supply current pass n g , 3.driving v o lt age for lcd pass n g , 4.contrast for lcd pass n g , 5.b/l driving method pass n g , 6.negative v o lt age output pass n g , 7.interfa c e function pass n g , 8.lcd uniformity pass n g , 9.esd test pass n g , 10.others pass n g , 6 sum m ar y s a l e s s i g n a t u r e customer signature dat e / /

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